PURPOSE: To produce a low m.p. and low activity Ti alloy excellent in ductility at room temp. and mechanical strength by imparting a compsn. consisting of specified amts. (wt.%) of Cu and Pd and the balance Ti with inevitable impurities.

CONSTITUTION: This low m.p. Ti alloy is a low m.p. Ti-Cu-Pd alloy having a compsn. consisting of specified amts. (wt.%) of Cu and Pd and the balance Ti with inevitable impurities. The amts. of Cu and Pd are within the region defined by a line connecting points (0, 12.2) and (9.1, 0) as [Cu (wt.%), Pd (wt.%)] in the Cu-Pd phase diagram, a line connecting points (0, 19.5) and (7.0, 0) and a line connecting points (0, 52.6) and (39.9, 0). This low m.p. Ti alloy may be composed of Ti-Cu-Ag or Ti-Pd-Ag alloy. A reaction with a casting mold material can be remarkably inhibited.