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Title:
LOW-PERMITTIVITY POLYMER FILM, PROCESS FOR FORMING THE SAME, AND INTERLAYER INSULATION FILM
Document Type and Number:
Japanese Patent JP3957811
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a low-permittivity polymer film which can be produced by a simple process, has stable characteristics, and can be used for an interlayer insulation film for a semiconductor device and provide a process for forming the same.
SOLUTION: This process comprises the first step of forming a polyurea film on a substrate by vapor deposition polymn., the second step of exposing the polyurea film to ultraviolet rays with wavelengths of 350 nm or lower at a dose of 10 mW/cm2 or higher, the third step (A) of thermally treating the film at 350°C for 30 min, the third step (B) of increasing the heating temp. to 400°C at a temp. rise rate of 1°C/min to form a polycarbodiimide, and the fourth step of forming a polycarbodiimide film.


Inventors:
Masayuki Iijima
Masatoshi Sato
Sadayuki Ukishima
Yoshikazu Takahashi
Application Number:
JP10108597A
Publication Date:
August 15, 2007
Filing Date:
April 03, 1997
Export Citation:
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Assignee:
ULVAC, Inc.
International Classes:
C08G18/82; C08J5/18; B32B27/28; B32B27/34; C08G18/02; C08G18/32; C08G18/78; C08G85/00; C23C14/12; H01L21/312; H01L21/768; H01L23/29; H01L23/31; H01L23/522; (IPC1-7): C08G18/32; B32B27/34; C08J5/18; C23C14/12; H01L21/312; H01L21/768; H01L23/29; H01L23/31; //C08G18/78; C08G85/00
Domestic Patent References:
JP7118385A
JP8148838A
JP8307020A
JP9008181A
JP10279649A
JP5311399A
JP7011424A
JP10251595A
Attorney, Agent or Firm:
Shigeo Ishijima
Hideki Abe