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Patent Searching and Data


Title:
LOW-RESISTANCE CONDUCTIVE RESIN COMPOSITION AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH10101947
Kind Code:
A
Abstract:

To obtain a conductive resin compsn. which has a higher electrical conductivity at the same carbon black content and is excellent in mechanical strengths, kneadability, and moldability by compounding a carbon black into a mixture comprising resin A which is the major component, resin B which is compatible with resin A at the gelling temp. of resin A or higher, and an oligomer which has the same main chain structure and functional groups as those of resin B.

Resin A is a thermoplastic resin such as polyethylene, polyvinyl chloride, or polypropylene. When resin A is polyethylene, resin B is pref. polypropylene, a fluororesin, or a fluororubber. The oligomer, the third ingredient, is at least a dimer and is an intermediate-mol.-wt. polymer having a mol.wt. of up to about 10,000, a pref. example being chlorinated paraffin. 100 pts.wt. resin A is mixed with 10-200 pts.wt. resin B and 10-200 pts.wt. oligomer. A carbon black, pref. Ketjenblack, is compounded in an amt. of 5-100wt.% of the total resin amt.


Inventors:
NISHIJIMA YOSHIAKI
Application Number:
JP25851896A
Publication Date:
April 21, 1998
Filing Date:
September 30, 1996
Export Citation:
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Assignee:
SHINETSU POLYMER CO
International Classes:
C08K3/04; C08L101/12; (IPC1-7): C08L101/12; C08K3/04
Attorney, Agent or Firm:
Ryoichi Yamamoto (1 person outside)