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Patent Searching and Data


Title:
LOW RESISTANCE EARTHING COMPOUND AND ITS PLACEMENT
Document Type and Number:
Japanese Patent JPS5456989
Kind Code:
A
Abstract:

PURPOSE: To place a low resistance earthing compound having an early setting property and a high solidification trength by the procedure in which a precast low resistance earthing compound of a specific composition containing a conductive chemical, water, Portland cement, and sodium silicate as a high early-strength chemical is laid underground and then an earth bar is struck into the earthing compound.

CONSTITUTION: A low resistance earthing compound is first prepared by mixing sodium silicate (1.0 in wt ratio), Potland cement (more than 4.0), water (more than 13.0), and a conductive chemical (more than 0.25), e.g., sodium chloride, carbon powder, bentonite, etc., and then the low resistance earthing compound so prepared is precast into a predetermined dimension of moldings. The precast moldings are delivered to a construction site in case it is used and then is laid underground at an earthing position without any mixing operation at site being carried out. And, the earth bar is struck into the earthing cmpound molding laid, thus simplifying the earthing operation


Inventors:
MATSUURA TAKETOSHI
SATOU YUKIHIKO
KIYOTANI YUKIO
Application Number:
JP12251677A
Publication Date:
May 08, 1979
Filing Date:
October 14, 1977
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
C09K3/00; H01R43/00; (IPC1-7): C09K3/00; H01R3/06