LOW RESISTANCE GROUNDING - NIPPON TELEGRAPH & TELEPHONE

Title:

LOW RESISTANCE GROUNDING

Document Type and Number:

Japanese Patent JPH01157074

Kind Code:

A

Abstract:

PURPOSE:To secure low resistance grounding easily by burying a ground metal pipe with a lot of holes into the ground, and spreading high water absorptive materials watered out of these holes over the ground. CONSTITUTION:A ground metal pipe 1 with a lot of holes 5 is driven into the ground, and high water absorptive materials of powdery maleic anhydride or the like watered out of the upper holes is pressed in the ground, or these high water absorptive materials are put in the pipe 1 in advance and then only water is injected or pressed therein otherwise. With this constitution, the watered high water absorptive materials 3' are discharged to the circumference of the pipe 1, whereby ground conductivity is heightened, and thus grounding resistance is lowered. Consequently, low resistance grounding is secured, and a secular change is little as well.

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Inventors:

YAMANE HIROSHI
KOGA HIROAKI
IDEGUCHI TAKESHI
NAKAI TAKASHI

Application Number:

JP31414387A

Publication Date:

June 20, 1989

Filing Date:

December 14, 1987

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