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Title:
低散乱シリカガラスおよびシリカガラスの熱処理方法
Document Type and Number:
Japanese Patent JP6372011
Kind Code:
B2
Abstract:
Provides is low scattering silica glass suitable as a material of an optical communication fiber. Silica glass has a fictive temperature of at least 1,000° C. and a void radius of at most 0.240 nm, as measured by positron annihilation lifetime spectroscopy. A method for heat-treating silica glass is also provided, which comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 30 MPa, and cooling the silica glass at an average temperature-decreasing rate of at least 40° C./min during cooling within a temperature range of from 1,200° C. to 900° C. A method for heat-treating silica glass also comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 140 MPa, and cooling the silica glass in an atmosphere under a pressure of at least 140 MPa during cooling within a temperature range of from 1,200° C. to 900° C.

Inventors:
Ono Enka
Setsuro Ito
Homma
Aino Yousuke
Application Number:
JP2015531827A
Publication Date:
August 15, 2018
Filing Date:
August 12, 2014
Export Citation:
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Assignee:
AGC Inc.
International Classes:
C03B20/00; C03C3/06; C03B25/02; G02B6/02; G03F1/60; G03F7/20
Domestic Patent References:
JP7300324A
JP5004830A
JP2009530217A
JP10114533A
JP7053225A
JP4164834A
JP4164833A
JP4149033A
JP1172239A
JP57034031A
Foreign References:
WO2008069194A1
WO2004050570A1
Attorney, Agent or Firm:
Nozomi Watanabe
Hideaki Ito
Takemoto Yoichi
Hirohisa Hachiya