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Title:
LOW SHRINKABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS58171412
Kind Code:
A
Abstract:

PURPOSE: The titled composition, prepared by incorporating an unsaturated polyester resin having maleic anhydride with a thermoplastic resin and a specific curing acceleration assistant respectively in specific proportions, and having stable low shrinkage property even in molding at a low temperature with a small reduction in strength.

CONSTITUTION: A low shrinkable resin composition prepared by incorporating (A) 100pts.wt. unsaturated polyester resin consisting of (i) 50W70mol%, based on the total acidic component, maleic anhydride or fumaric acid and (ii) a polymerizable monomer, e.g. styrene, with (B) 10W50pts.wt. thermoplastic resin, preferably polystyrene, and (C) 0.01W0.2pts.wt. amine compound, preferably dimethylaniline, or a keto-enol tautomeric compound, preferably acetylketone, as a curing acceleration assistant.


Inventors:
TADOKORO HIROO
SUZUKI KAZUO
Application Number:
JP2009282A
Publication Date:
October 08, 1983
Filing Date:
February 10, 1982
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L7/00; C08F283/01; C08F299/00; C08F299/04; C08K5/07; C08K5/17; C08L33/00; C08L33/02; C08L67/00; C08L67/06; (IPC1-7): C08F299/04; C08K5/07; C08K5/17; C08L67/06
Domestic Patent References:
JPS54124092A1979-09-26
JPS5580423A1980-06-17
Attorney, Agent or Firm:
Kunihiko Wakabayashi