PURPOSE: To form a low stress additive suitable for lowering the internal stress of an epoxy resin compsn. for sealing an electric or electronic part by compounding composite org. polymer particles and a fluid silicon-containing compd.
CONSTITUTION: This low stress additive is formed of composite org. polymer particles (a) in amt. effective for applying desired reduction to the internal stress of a compsn. for molding a cured epoxy resin and a fluid silicon- containing compd. (b) in an amt. effective for keeping the flowability of an epoxy resin without substantial resin bleed. As the liquid silicon-containing compd., an organopolysiloxane is pref. and, as the composite polymer particles, methacrylate/butadiene/styrene polymer particles are pref. The compounding amts. of components (a), (b) to an epoxy resin sealant compsn. are set so that the component (a) is about 0.1-20 wt.% and the component (b) is about 0.1-10 wt.%.
RAJIBU HAASHIYADORAI NAIKU
GEIRII RII RINDEN
