Title:
LOW STRESS DIE ATTACHMENT
Document Type and Number:
Japanese Patent JP2012004602
Kind Code:
A
Abstract:
To provide a package, a mass coupled to the package and one or a plurality of resilient couplings for attaching the mass to the package.
A method for attaching a mass to a package is provided. The method includes resiliently attaching the mass to the package, at one or a plurality of locations.
Inventors:
SELVAKUMAR ARDIAN
JAMES L MARSH
HOWARD D GOLDBERG
YU DEYU-LEE
W MARC STALNAKER
JAMES L MARSH
HOWARD D GOLDBERG
YU DEYU-LEE
W MARC STALNAKER
Application Number:
JP2011220255A
Publication Date:
January 05, 2012
Filing Date:
October 04, 2011
Export Citation:
Assignee:
ION GEOPHYSICAL CORP
International Classes:
G01P21/00; H01L21/60; G01D11/24; G01D18/00; G01H1/00; G01L27/00; G01P1/02; G01P15/08; G01P15/125; G01P15/13; G01V1/047; G01V1/053; G01V1/104; G01V1/18; G01V1/40; H01L29/84; H05K5/00; G01N1/02
Domestic Patent References:
| JPH10163270A | 1998-06-19 | |||
| JPH07106334A | 1995-04-21 | |||
| JPS527676A | 1977-01-20 | |||
| JPS476130B1 | ||||
| JPH06120225A | 1994-04-28 | |||
| JPH01152637A | 1989-06-15 | |||
| JPH10209220A | 1998-08-07 |
Attorney, Agent or Firm:
Okabe
Masao Okabe
Koji Yoshizawa
Masao Okabe
Koji Yoshizawa