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Patent Searching and Data


Title:
LOW TEMPERATURE BAKED GOLD PASTE
Document Type and Number:
Japanese Patent JPH10340619
Kind Code:
A
Abstract:

To provide an excellent gold film even if it is baked at a temperature not more than a heat resistant temperature of glass substrate by manufacturing it by kneading/dispersing gold particles having the specific particle size, glass frit having a softening point of a specific temperature and an organic vehicle.

The particle size of gold particles is set not more than 1.0 μm, and therefore, heat capacity of the individual gold particles is reduced, and sintering of the mutual gold particles is improved at baking time, and a resistance value does not become high. A softening point of glass frit is set not more than 450°C, and therefore, when it is bake at 500 to 600°C, the glass frit is excellently fixed between a glass substrate and a gold film, and adhesion strength is enhanced, and glass does not interpose as a resistor between the gold particles. Paste by kneading/dispersing a mixture of a prescribed rate of these gold particles, glass frit and organic vehicle by three rollers and a blender or the like, is printed, dried and baked on the glass substrate, and a gold film electrode or the like is obtained. Therefore, there is no necessity for divided processing and assembling of an expensive device and parts like an evaporation method.


Inventors:
SEKO YASUSHI
Application Number:
JP14738097A
Publication Date:
December 22, 1998
Filing Date:
June 05, 1997
Export Citation:
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Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
H01B1/16; H05K1/09; (IPC1-7): H01B1/16