PURPOSE: To obtain the titled paste outstanding in electrical conductivity and solderability, applicable to even resin substrates, by dispersing metallic powder of low resistivity in a metal alkoxide admixed with small amount of water.

CONSTITUTION: The objective paste can be obtained by dispersing, in (A) a metal alkoxide [e.g., Si(OC2H5), Al(OC3H7)3, Pb(OC5H11)2] admixed with small amount of water, (B) metallic powder with a resistivity ≤6×10-6Ω.cm (e.g., Cu Au, Ag, Ag-Pd, Ni, Al, Mo, W) so that the proportion of the component A is 5W50wt.% on a metal oxide basis.