Title:
低温硬化性エポキシ樹脂プライマー又は接着剤
Document Type and Number:
Japanese Patent JP6839092
Kind Code:
B2
Abstract:
The invention relates to the use of an epoxy resin composition, containing at least one reaction product from the reaction of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as a cold curing primer or adhesive. Primers or adhesives of this type cure rapidly and trouble-free at ambient temperature, even at cold temperatures such as 10 or 5° C., suffer remarkably little yellowing and are free from toxic phenol compounds such as phenol, tert-butylphenol or nonylphenol. The primer has a particularly low viscosity and is particularly suitable for priming porous mineral substrates.
Inventors:
Edith Kasemi
Andreas Clammer
Ursula Staderman
Ursch Burghard
Andreas Clammer
Ursula Staderman
Ursch Burghard
Application Number:
JP2017550174A
Publication Date:
March 03, 2021
Filing Date:
March 23, 2016
Export Citation:
Assignee:
Seeka Technology Akchen Gezel Shaft
International Classes:
C09D163/00; C08G59/64; C09D5/00; C09D7/63; C09D179/02; C09J11/06; C09J163/00; C09J179/02
Domestic Patent References:
| JP57044621A | ||||
| JP2014520922A |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Nobuo Sekine
Naori Kota
Kazuya Shiokawa
Shinji Mitsuhashi
Nobuo Sekine
Naori Kota
Kazuya Shiokawa