低温安定性に優れる低熱膨張合金、その製造方法、低熱膨張合金粉末、および積層造形部材

Title:

低温安定性に優れる低熱膨張合金、その製造方法、低熱膨張合金粉末、および積層造形部材

Document Type and Number:

Japanese Patent JP6592222

Kind Code:

B2

Abstract:

Provided is a low thermal expansion alloy characterized by containing, in terms of mass%, no more than 0.05% C, no more than 0.4% Si, no more than 0.5% Mn, 32.5-34.5% Ni, and 2.0-4.5% Co, the Ni + 0.78 Co content being 35.5-36.5%, and the remainder comprising Fe and unavoidable impurities, the low thermal expansion alloy having a solidification structure in which the secondary dendrite arm spacing is 5 µm or less, and the low thermal expansion alloy having an average thermal expansion coefficient in the range of 0±0.5 ppm/°C at a temperature of 10-40°C and an Ms point of -100°C or lower.

Inventors:

Takuo Handa
Liu Zhimin
Nobuyuki Oyama

Application Number:

JP2019513870A

Publication Date:

October 16, 2019

Filing Date:

June 04, 2018

Export Citation:

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