Title:
金属部品間の低熱伝導インターフェース
Document Type and Number:
Japanese Patent JP5886327
Kind Code:
B2
Abstract:
A low-heat-transfer coupling or assembly is configured to mechanically couple together a pair of mating parts, one of which may be in a heat-producing environment. By roughening at least part of the surface of one of the parts, the contact area between the mating parts can be reduced, while still maintaining the structural integrity of the connection. The roughening can be a knurling process of all or part of the mating surface on one of the parts. This can produce a series of recesses on the surface that are in contact with the other part. The recesses can be small enough, interspersed with non-etched areas of the contact surface, that structural integrity of the coupling between the parts is still maintained. The coupling may be between a leading edge of an aircraft control surface, such as a missile fin, and a body of the control surface.
Inventors:
Christo, Kyriacos
Application Number:
JP2013558005A
Publication Date:
March 16, 2016
Filing Date:
October 27, 2011
Export Citation:
Assignee:
RAYTHEON COMPANY
International Classes:
B23P9/02; B21J15/02; B21J15/14; B64C1/40; B64C3/36; F42B15/00
Domestic Patent References:
| JP7260400A | ||||
| JP8278099A |
Foreign References:
| WO2011064406A1 | ||||
| US5348210 | ||||
| US6367740 | ||||
| US20110033281 |
Attorney, Agent or Firm:
Kurata Masatoshi
Yoshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Takashi Mine
Katsu Sunagawa
Yoshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Takashi Mine
Katsu Sunagawa