Title:
LOW VISCOSITY COPPER INK COMPOSITE FOR METALLIZING CERAMICS
Document Type and Number:
Japanese Patent JPH05114306
Kind Code:
A
Abstract:
PURPOSE: To provide a low viscosity copper ink composite for metallizing a ceramic.
CONSTITUTION: A low viscosity copper ink composite for metallizing a ceramic, which consists of a metallic component mainly of copper, a binder, and an organic component, and having 20 to 100 cP of viscosity is composed. By using this composite with a brush, for example, the copper metallizing can be applied freely to a curving part of a ceramic. Since a copper film can be formed on a curving form of ceramic by such a simple means, it can be applied to a complicated form of electronic part.
Inventors:
MINAMI NOBUYUKI
ISHIDA YOICHI
HANAOKA OSAMU
YOSHIDA HIDETO
ISHIDA YOICHI
HANAOKA OSAMU
YOSHIDA HIDETO
Application Number:
JP29813091A
Publication Date:
May 07, 1993
Filing Date:
October 18, 1991
Export Citation:
Assignee:
NIHON CEMENT
International Classes:
C09D11/00; H01B1/22; H05K1/09; (IPC1-7): C09D11/00; H01B1/22; H05K1/09
Attorney, Agent or Firm:
Noriaki Miyakoshi