Title:
LUBRICATING MOLD-RELEASE AGENT FOR HOT STAMPING
Document Type and Number:
Japanese Patent JP2012255085
Kind Code:
A
Abstract:
To provide a lubricating mold-release agent for hot stamping, which can facilitate processing and releasing by reducing friction caused between a material to be processed and a mold when a steel plate is subjected to hot stamping, thereby preventing the material and the mold from being damaged.
A solid lubricant-dispersed water-based lubricating mold-release agent is used when the steel plate is subjected to the hot stamping, wherein the lubricating mold-release agent comprises: a solid lubricant; a water-soluble polymer; carboxylate salt; a surfactant; and water.
Inventors:
IKEDA NOBUHIRO
UDA KOSUKE
SHODOSHIMA AKIRA
UDA KOSUKE
SHODOSHIMA AKIRA
Application Number:
JP2011128848A
Publication Date:
December 27, 2012
Filing Date:
June 09, 2011
Export Citation:
Assignee:
DAIDO CHEM IND CO LTD
NAT UNIV YOKOHAMA
NAT UNIV YOKOHAMA
International Classes:
C10M173/02; C10M103/00; C10M103/06; C10M105/26; C10M105/70; C10M107/36; C10M129/34; C10M129/42; C10M129/50; C10M129/52; C10M143/06; C10M145/04; C10M145/14; C10M145/16; C10M145/28; C10M145/34; C10M145/40; C10M149/10; C10N10/02; C10N10/04; C10N10/08; C10N20/06; C10N30/06; C10N40/36
Domestic Patent References:
| JPS57501918A | 1982-10-28 | |||
| JP2005314558A | 2005-11-10 |
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office
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