Title:
発光デバイス冷却
Document Type and Number:
Japanese Patent JP6741681
Kind Code:
B2
Abstract:
A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.
Inventors:
Sweegers, Norbertus Antonius Maria
Desambar, Marc Andre
Zydema, Patrick
Desambar, Marc Andre
Zydema, Patrick
Application Number:
JP2017546952A
Publication Date:
August 19, 2020
Filing Date:
March 03, 2016
Export Citation:
Assignee:
Lumileds Holding Buffet
International Classes:
H01L33/64; F21S2/00; F21V29/70; H01L33/44
Domestic Patent References:
| JP2007250255A | ||||
| JP2010525586A | ||||
| JP2008507135A | ||||
| JP2002353563A | ||||
| JP2014127679A | ||||
| JP2015513229A |
Foreign References:
| US20120241793 | ||||
| US20100213479 | ||||
| US20090230417 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki