Luminescent device

Japanese Patent JP6036913

B2

[Object] Disclosed is a light emitting device that enables a small and lightweight semiconductor package to be precisely mounted on a packaging substrate. [Means for Solving Problem] A light emitting device being such that a semiconductor package equipped with a first conduction member and a second conduction member, and a mounting board equipped with a first wiring component and a second wiring component that are respectively connected to the first conduction member and the second conduction member by a joining member, the semiconductor package comprises: a light emitting element; a first conduction member, on one side of which the light emitting element is placed; and a second conduction member whose surface area is smaller than that of the first conduction member, the other side of the first conduction member and the second conduction member, on the opposite side from said one side, forms the lower face of the semiconductor package, and the mounting board comprises: a narrow part and a wide part that extends away from the first and second conduction members and is wider than the narrow part, which are formed on the first wiring component and the second wiring component, at least the narrow part is joined to the first conduction member and the second conduction member, and the first wiring component has a recess in its interior.

Takuya Nakabayashi

JP2015091744A

November 30, 2016

April 28, 2015

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Nichia Corporation

H01L33/62; H01L33/54

JP2003324214A
JP2009141006A
JP5037144A
JP2036073U
JP2008112944A

Shinki Global IP Patent Corporation

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