Title:
Luminescent device
Document Type and Number:
Japanese Patent JP6070188
Kind Code:
B2
Abstract:
In a light emitting device, one of at least one reinforcing portion is disposed on a site for joining regions of two wiring portions. The site for joining regions is provided for at least a first joining region where the first groove portion and the third groove portion join, and a second joining region where the second groove portion and the third groove portion join. A light emitting element is disposed over the third groove portion. In a plan view of the substrate member, the reinforcing portion surrounds the light emitting element. The upper surface of the reinforcing portion is lower than the upper surface of the light emitting element.
Inventors:
Tadaaki Miyata
Application Number:
JP2012288984A
Publication Date:
February 01, 2017
Filing Date:
December 28, 2012
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/48; H01L33/62
Domestic Patent References:
| JP11163412A | ||||
| JP2002368349A | ||||
| JP2003092011A | ||||
| JP2009218625A | ||||
| JP2011029634A | ||||
| JP2012142362A | ||||
| JP2012059736A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
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