Title:
熱散逸サポートをもつ発光アセンブリ
Document Type and Number:
Japanese Patent JP4808945
Kind Code:
B2
Abstract:
A light emitting assembly includes a metal substrate for dissipating heat from the assembly. The metal substrate includes an electrically insulating layer or coating on at least one side. Circuit traces are applied to the electrically insulating layer using either thick or thin film techniques. At least the ends of the circuit traces include a metallic section to which leads of light emitting elements are soldered or wire-bonded. A metallic section is provided adjacent the light emitting element to transfer heat to the underlying substrate and/or to reflect light from the element away from the substrate. A clear finish retards tarnishing of the reflecting metallic section.
Inventors:
Thomas M. Maurice
Application Number:
JP2004242669A
Publication Date:
November 02, 2011
Filing Date:
August 23, 2004
Export Citation:
Assignee:
International Resistive Company of Texas, L.P.
International Classes:
H01L33/00; F21K99/00; F21V29/00; H05K1/02; F21S8/00; F21S8/10; F21Y101/02; H05K1/05; H05K1/09; H05K1/18; H05K3/28
Domestic Patent References:
| JP5259201A | ||||
| JP57024597A | ||||
| JP57060894A | ||||
| JP55093286A | ||||
| JP2001007391A | ||||
| JP61079239A | ||||
| JP2003124524A | ||||
| JP5170028A | ||||
| JP53032376A | ||||
| JP9298313A | ||||
| JP59184586A | ||||
| JP6077540A | ||||
| JP2000277813A | ||||
| JP62298036A |
Foreign References:
| WO2002012788A1 | ||||
| US20030193055 | ||||
| EP1139019A1 |
Attorney, Agent or Firm:
Sakuo Yamaguchi