Title:
MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016171393
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a MEMS device in which the operation space of an operation element is sealed so as to be able to keep a desired vacuum, by bonding an element wafer in which an operation element, such as a MEMS vibrator, is formed and a sealing wafer having a through electrode.SOLUTION: A MEMS device has an element wafer 1 including a recess (operation space) 120 housing an operation element such as a MEMS vibrator 2, and a sealing wafer 5 being bonded to the element wafer 1 so as to become a lid body forming the operation space by sealing the recess. The sealing wafer 5 has a through electrode 6 for connection with a connection electrode 7 of the element wafer 1 by exposing one end to a surface bonded to the element wafer 1. The sealing wafer 5 seals the operation space 120 after high temperature degassing by normal temperature bonding to the element wafer 1 in a vacuum atmosphere, and one end of the through electrode 6 at the time of normal temperature bonding after high temperature degassing is flush with a surface on which the sealing wafer 5 is bonded to the element wafer 1.SELECTED DRAWING: Figure 2
Inventors:
TASHIRO AKIHIKO
Application Number:
JP2015048503A
Publication Date:
September 23, 2016
Filing Date:
March 11, 2015
Export Citation:
Assignee:
NIHON DEMPA KOGYO CO
International Classes:
H03H9/24; B81B3/00; B81C3/00; H03H3/007
Attorney, Agent or Firm:
Tomihiko Isono
Akira Okawa
Akira Okawa