Title:
ＭＥＭＳデバイス、ＭＥＭＳスイッチ及びＭＥＭＳスイッチの製造方法
Document Type and Number:
Japanese Patent JP6747786
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a MEMS device with high adhesion between a transmission line and an insulator layer, a MEMS switch, and a manufacturing method of the same.SOLUTION: Between a high frequency line 21 and an insulator layer 24, a thin film adhesion layer 23, having insulating properties, made of a material having higher (high-frequency) insulating properties than the insulator layer 24, is formed. By providing the thin film adhesion layer 23 made of a material being closely in contact with both the high frequency line 21 and the insulator layer 24, it becomes possible to increase adhesion between the high frequency line 21 and the insulator layer 24 than before. As a result, a leakage route is not formed between the high frequency line 21 and the insulator layer 24.SELECTED DRAWING: Figure 1
Inventors:
Hideharu Tanaka
Moriyama Masaaki
Norihiko Sasaki
Kazuya Komori
Toshiyuki Hiraki
Moriyama Masaaki
Norihiko Sasaki
Kazuya Komori
Toshiyuki Hiraki
Application Number:
JP2015160500A
Publication Date:
August 26, 2020
Filing Date:
August 17, 2015
Export Citation:
Assignee:
Tohoku University
Hokuriku Electric Industry Co., Ltd.
Hokuriku Electric Industry Co., Ltd.
International Classes:
H01H57/00; B81B3/00; B81C3/00; H01H49/00
Domestic Patent References:
| JP2009110974A | ||||
| JP2013166194A | ||||
| JP2015088339A | ||||
| JP2005166622A |
Attorney, Agent or Firm:
西浦 ▲嗣▼晴
High Miki Yoshiki
Tadashi Deyama
Toshihisa Sakai
High Miki Yoshiki
Tadashi Deyama
Toshihisa Sakai