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Title:
MEMS ELEMENT AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2020028946
Kind Code:
A
Abstract:
To provide a high-sensitivity MEMS element in which the effect of tensile stress from a support film is reduced.SOLUTION: A gap 13 is provided between a fixed electrode 5 and a support film 7 to have a structure in which at least one connection portion 12 for connecting the fixed electrode and the support film is provided in the gap portion. This structure can reduce the effect of tensile stress from the support film and simply suppress the occurrence of warpage in the fixed electrode.SELECTED DRAWING: Figure 5

Inventors:
ARAKI SHINICHI
Application Number:
JP2018155699A
Publication Date:
February 27, 2020
Filing Date:
August 22, 2018
Export Citation:
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Assignee:
NEW JAPAN RADIO CO LTD
International Classes:
B81C1/00; B81B3/00; H04R19/04; H04R31/00
Domestic Patent References:
JP2013506154A2013-02-21
JP2001502247A2001-02-20
JP2003245897A2003-09-02
JP5402823B22014-01-29
JP2011055087A2011-03-17
JP2018058150A2018-04-12
JP2016185574A2016-10-27
JP2009017578A2009-01-22
JP2016102693A2016-06-02



 
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