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Title:
MEMSガスセンサー、及びそのアレイ、製造方法
Document Type and Number:
Japanese Patent JP7443618
Kind Code:
B2
Abstract:
A MEMS gas sensor (A), an array thereof, and a preparation method therefor. The MEMS gas sensor (A) comprises a first substrate (A2) provided with a first cavity (A1), and N gas detection assemblies (A3) provided at an opening of the first cavity (A1), wherein each gas detection assembly (A3) comprises: a supporting arm (A31) and a gas detection part (A32) provided on the supporting arm (A31); the gas detection part (A32) comprises a strip-shaped heating electrode part (A321), an insulating layer (A322), a strip-shaped detection electrode part (A323), and a gas-sensitive material part (A324) that are stacked in sequence; the strip-shaped detection electrode part (A323) comprises a first detection electrode part (A323-1) and a second detection electrode part (A323-2) with a first opening (A325) provided therebetween; the gas-sensitive material part (A324) is provided at the first opening (A325); a first end of the gas-sensitive material part (A324) is connected to the first detection electrode part (A323-1), and a second end of the gas-sensitive material part (A324) is connected to the second detection electrode part (A323-2); and the strip-shaped heating electrode parts (A321) in each gas detection assembly (A3) are connected in sequence to form a heater (A8).

Inventors:
Shoe, ray
Xie, Dongchen
Chen, Dong Liang
Application Number:
JP2023500116A
Publication Date:
March 05, 2024
Filing Date:
July 10, 2020
Export Citation:
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Assignee:
Wiener Company Limited
International Classes:
G01N27/12
Domestic Patent References:
JP2014153135A
JP2017090188A
JP2015200644A
JP2004037180A
Foreign References:
KR1020050097421A
US20150285772
Attorney, Agent or Firm:
Patent Attorney Corporation Hiraki International Patent Office