Title:
ＭＥＭＳセンサパッケージング方法
Document Type and Number:
Japanese Patent JP5923617
Kind Code:
B2
Abstract:
The present invention relates to a MEMS sensor packing and a method thereof. The MEMS sensor packaging includes: a first wafer on which on an ROIC circuit is disposed; a second wafer disposed to correspond to the first wafer and having a concave portion in one surface thereof to provide a MEMS sensor; a bonding solder disposed around the MEMS sensor to bond the first and second wafers to each other, thereby sealing the MEMS sensor; and a solder pad electrically connecting the ROIC circuit of the first wafer to the MEMS sensor of the second wafer. According to the present invention, when the wafer on which the ROIC circuit is disposed and the wafer on which the MEMS sensor is disposed are bonded to package the bonded wafers, the solder pad for electrically connecting the ROIC sensor to the MEMS sensor may be provided within the package to reduce the size of the package and stably supply an electrical signal.
Inventors:
Han Young
Kim Hyun Won
Anseok
Kim Hyun Won
Anseok
Application Number:
JP2014540951A
Publication Date:
May 24, 2016
Filing Date:
November 09, 2012
Export Citation:
Assignee:
You Electronics Shio.
International Classes:
B81B7/02; B81C3/00; G01J1/02; G01J1/04; H01L21/60; H01L23/02
Domestic Patent References:
| JP2008034515A | ||||
| JP2003520447A | ||||
| JP2006116694A | ||||
| JP2010032292A |
Foreign References:
| US20090029152 |
Attorney, Agent or Firm:
Mikio Yoshimiya