Title:
ＭＥＭＳセンサ
Document Type and Number:
Japanese Patent JP5723739
Kind Code:
B2
Abstract:
There is provided a MEMS sensor including a signal processing LSI equipped with a temperature sensor for measuring temperature of a sensor, and a MEMS sensor chip overlaid on the signal processing LSI, the MEMS sensor chip being mounted on a heat generating part of the signal processing LSI. This MEMS sensor decreases the effects caused by thermally triggered changes in temperature characteristics.
More Like This:
| JP2024056460 | inertial sensor |
| JP2019200150 | SEMICONDUCTOR DYNAMIC QUANTITY SENSOR |
| JP3810249 | ACCELERATION SENSOR |
Inventors:
Ichiro Osaka
Kazunori Ota
Kazunori Ota
Application Number:
JP2011215901A
Publication Date:
May 27, 2015
Filing Date:
September 30, 2011
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
G01P15/08; G01C19/5783; G01P1/02; G01P15/18
Domestic Patent References:
| JP2010204038A | ||||
| JP2009053100A | ||||
| JP10010148A | ||||
| JP6066568A | ||||
| JP2002181550A | ||||
| JP2008203155A | ||||
| JP2011128140A | ||||
| JP2011061132A | ||||
| JP2010219243A |
Attorney, Agent or Firm:
Manabu Inoue