To provide a method for depositing a GaN-based compound semiconductor layer having a low crystal defect density and almost free from production of piezo spontaneous polarization.
The method for depositing the GaN-based compound semiconductor layer includes steps of: (A) forming a plurality of seed layers 11 each comprising a GaN-based compound semiconductor on the R face of a sapphire substrate 10 in a mutually separated state; (B) epitaxially growing GaN-based compound semiconductor layers 12, 14, in which a crest plane is an A plane and which are nearly parallel to the R plane of the sapphire substrate 10, in a horizontal direction from each seed layer 11; and (C) polishing the crest plane 14A of the GaN-based compound semiconductor layers 12, 14 so as to make it into an inclined state with respect to the R plane of the sapphire substrate 10.
BIWA TSUYOSHI
JP2001039800A | 2001-02-13 | |||
JP2001160656A | 2001-06-12 | |||
JP2001160539A | 2001-06-12 | |||
JP2002029897A | 2002-01-29 | |||
JP2000223743A | 2000-08-11 | |||
JP2002033282A | 2002-01-31 |
WO2004061909A1 | 2004-07-22 |
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