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Title:
METHOD FOR DEPOSITING GaN-BASED COMPOUND SEMICONDUCTOR LAYER AND METHOD FOR MANUFACTURING GaN-BASED SEMICONDUCTOR LIGHT-EMITTING ELEMENT
Document Type and Number:
Japanese Patent JP2006347832
Kind Code:
A
Abstract:

To provide a method for depositing a GaN-based compound semiconductor layer having a low crystal defect density and almost free from production of piezo spontaneous polarization.

The method for depositing the GaN-based compound semiconductor layer includes steps of: (A) forming a plurality of seed layers 11 each comprising a GaN-based compound semiconductor on the R face of a sapphire substrate 10 in a mutually separated state; (B) epitaxially growing GaN-based compound semiconductor layers 12, 14, in which a crest plane is an A plane and which are nearly parallel to the R plane of the sapphire substrate 10, in a horizontal direction from each seed layer 11; and (C) polishing the crest plane 14A of the GaN-based compound semiconductor layers 12, 14 so as to make it into an inclined state with respect to the R plane of the sapphire substrate 10.


Inventors:
OKUYAMA HIROYUKI
BIWA TSUYOSHI
Application Number:
JP2005177442A
Publication Date:
December 28, 2006
Filing Date:
June 17, 2005
Export Citation:
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Assignee:
SONY CORP
International Classes:
C30B29/38; C30B25/18; H01L21/205; H01L33/06; H01L33/32; H01L33/42
Domestic Patent References:
JP2001039800A2001-02-13
JP2001160656A2001-06-12
JP2001160539A2001-06-12
JP2002029897A2002-01-29
JP2000223743A2000-08-11
JP2002033282A2002-01-31
Foreign References:
WO2004061909A12004-07-22
Attorney, Agent or Firm:
Takahisa Yamamoto