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Title:
METHOD FOR EFFICIENT Al-C COVALENT BOND FORMATION BETWEEN ALUMINUM AND CARBON MATERIAL
Document Type and Number:
Japanese Patent JP2009161849
Kind Code:
A
Abstract:

To solve the existing problem about bonding between aluminum and a carbon material and to manufacture a carbon material/aluminum composite having lightweight and excellent mechanical strength using an electric arc or electrochemical technique.

A method for forming an Al-C covalent bond in aluminum-carbon material using an electrochemical technique is provided. The method may include steps of: applying a potential to an electrochemical apparatus which comprises an anode and a cathode having a carbon material connected thereto and is filled with an electrolyte; and plating a surface of the carbon material connected to the cathode with aluminum. Further, a method for manufacturing an aluminum/carbon material composite in which a covalent bond is formed by applying a potential to the electrochemical apparatus and plating the surface of the carbon material with aluminum is provided. The aluminum/carbon material composite manufactured by the method is also provided.


More Like This:
JPH0317243TANTALUM-CONTAINING SUPERALLOY
Inventors:
SO KANG PYO
LEE YOUNG HEE
AN KAY HYEOK
Application Number:
JP2008191441A
Publication Date:
July 23, 2009
Filing Date:
July 24, 2008
Export Citation:
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Assignee:
SUNGKYUNKWAN UNIV FOUNDATION F
DAYOU SMART ALUMINUM CO LTD
International Classes:
C22C1/10; B22F3/14; C01B31/02; C22C47/02; C22C47/14; C22C49/14; C22C101/10; C22C121/00
Domestic Patent References:
JPH05117716A1993-05-14
JPH0293032A1990-04-03
JP2003337113A2003-11-28
Foreign References:
WO2006103798A12006-10-05
WO2005040068A12005-05-06
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation



 
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