Title:
METHOD OF FORMING Re FILM BY ELECTROPLATING
Document Type and Number:
Japanese Patent JP3904197
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an Re film which is used, e.g. for a corrosion resistant alloy film for a high temperature apparatus member such as a turbine blade by aqueous solution electroplating.
SOLUTION: A plating bath consisting of an aqueous solution containing perrheate ions of 0.1 to 8.0 mol/l, and at least one kind selected from nickel ions, iron ions, cobalt ions, and chromium (III) ions of 0.005 to 2.0 mol/l in total, and at least one kind selected from lithium ions and sodium ions of 0.0001 to 5.0 mol/l in total, and in which the concentration of at least one kind of organic acid selected from carboxylic acid, hydroxycaroxylic acid, and amino acid is >5.0 to 15.0 equivalent weight to the total metallic ion concentration, and whose pH is controlled to 0 to 8, and solution temperature to 10 to 80°C is used. The atomic composition of the film can consist of ≥98% Re.
Inventors:
Toshio Narita
Shigenari Hayashi
Takayuki Yoshioka
Hiroshi Hachiho
Soma Michiaki
Shigenari Hayashi
Takayuki Yoshioka
Hiroshi Hachiho
Soma Michiaki
Application Number:
JP2002010811A
Publication Date:
April 11, 2007
Filing Date:
January 18, 2002
Export Citation:
Assignee:
Japan Science and Technology Agency
Ebara Corporation
Sapporo Electroplating Industry Co., Ltd.
Ebara Corporation
Sapporo Electroplating Industry Co., Ltd.
International Classes:
C25D3/56; F01D5/28; C25D3/54; F02C7/00; (IPC1-7): C25D3/54; C25D3/56; F01D5/28; F02C7/00
Domestic Patent References:
| JP6025917B2 | ||||
| JP2174253A |
Attorney, Agent or Firm:
Yoshiyuki Nishi
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