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Patent Searching and Data


Title:
METHOD OF PRODUCING Ni-PLATED COPPER OR COPPER ALLOY SHEET
Document Type and Number:
Japanese Patent JP2014145092
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of producing a Ni-plated copper or a copper alloy sheet by which reduction in gloss due to Ni plating can be suppressed.SOLUTION: A chemical film is formed on a copper or a copper alloy sheet by performing chemical polishing treatment of a surface of the copper or the copper alloy sheet, then immersing the copper or the copper alloy sheet into a chemical treatment liquid having a concentration of chemical film forming agent of 0.01 to 1 g/L, a chloride ion concentration of 0.01 to 1 g/L, pH of 2 or less and a temperature of 10 to 80°C for 10 to 300 seconds, and then Ni plating is formed on the copper or the copper alloy sheet in a state where the chemical film is formed.

Inventors:
KUBOTA KENJI
TARUTANI YOSHIE
KATO NAOKI
Application Number:
JP2013012747A
Publication Date:
August 14, 2014
Filing Date:
January 28, 2013
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C25D5/34; C23C22/52; C25D7/00; C22C9/00
Attorney, Agent or Firm:
Aoyama Masakazu