Title:
ＭＩＭＯアンテナ装置
Document Type and Number:
Japanese Patent JP7108110
Kind Code:
B2
Abstract:
The present disclosure relates to an MIMO antenna apparatus, and in particular, includes a PCB having at least one heat-generation element provided on one surface thereof, a first heat-dissipation part disposed to cover one surface of the PCB, having a through hole formed in a portion corresponding to the position provided with the heat-generation element, and having a plurality of vertical heat-dissipation fins formed to be extended in a direction perpendicular to the outside surface thereof, and a second heat-dissipation part detachably coupled to the through hole to contact one surface of the heat-generation element to receive heat from the heat-generation element and to dissipate heat at a long distance father than the first heat-dissipation part, thereby enhancing heat-dissipation performance and expanding universality of a product.
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Inventors:
Chang Woo Yo
In Hokim
Minsik Park
Hey Young Kim
In Hokim
Minsik Park
Hey Young Kim
Application Number:
JP2021132147A
Publication Date:
July 27, 2022
Filing Date:
August 16, 2021
Export Citation:
Assignee:
KW Incorporated
International Classes:
H05K7/20; H01L23/36
Domestic Patent References:
| JP6188344A | ||||
| JP20028923A | ||||
| JP200780989A | ||||
| JP2012521657A | ||||
| JP2013143488A | ||||
| JP2017228748A |
Foreign References:
| US20080037226 | ||||
| US20100008045 |
Attorney, Agent or Firm:
Patent Attorney Imy International Patent Office
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