To provide a machine for removing the surfaces of semiconductors, particularly the surfaces with integrated circuits.
The machine for removing the surfaces with the integrated circuits comprises: a laser emitter means 11, the beam of which is designed to strike at least one semiconductor wafer 13 or at least a fragment thereof, for ablation of a surface layer of preset thickness; a supporting means 14 for the semiconductor wafer or the fragment thereof; and a means 15 for relative movement of the emitter means with respect to at least one semiconductor wafer or the fragment thereof, the means 15 for relative movement of the emitter means being adapted to make the laser emitter means follow a path such that a laser beam emitted from the emitter travels over the entire surface to be removed of the semiconductor wafer or the fragment thereof.
Mitsuo Tanaka
Mitsuo Wada