To simplify the structure and operation for machining an electronic component while facilitating the machining by making a groove communicating respective machining components in a lower die provided in conjunction with an upper die and fitting a carrier provided with a recess to be fitted with an electronic component in the groove such that the carrier can elevate/lower and move freely between adjacent machining components.

A molding punch for molding an electronic component body, cutting the forward end of a terminal and bending the terminal is fixed with a backing plate 5 to constitute an upper die. A molding die corresponding to the molding punch is fixed with a backing plate 9 to constitute a lower die for supporting the upper die. A carrier 10 provided on a die plate 8 in the vicinity of the molding die operates iteratively in a groove 8a slightly wider than the thickness of the carrier 10 in the horizontal and vertical directions. The carrier 10 is provided, at the upper part thereof, with a plurality of recesses 10a slightly shallower but wider than the body part at a constant interval in order to carry electronic components 16a-16c while fitting them in the recesses 10a.