To provide a machining device for a transparent medium in which machining is performed in the optimal state by monitoring the state of light in a position (machining point) where the interaction between a machining laser beam and an object to be machined occurs in the case of machining a transparent medium by the laser beam or the like.
The device is provided with an optical control part 2 for variably controlling the state of the laser beam emitted from a light source part 1 and a light state measuring part 4 for measuring the state of the laser beam within the object TG to be machined. The optical control part is adjusted based on output from the light state measuring part so that the state of the laser beam within the object to be machined becomes a desired state. Since the state of the laser beam within the object to be machined consisting of a transparent medium such as glass is measured in the light state measuring part and is fed back to the optical control part, laser machining is performed while maintaining the optimal state at a machining point within the object to be machined.
AOSHIMA SHINICHIRO
KUMAGAI HIROSHI
MIDORIKAWA KATSUMI
HAMAMATSU PHOTONICS KK
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