Title:
MACHINING DEVICE OF WORKPIECE AND MACHINING METHOD OF WORKPIECE
Document Type and Number:
Japanese Patent JP2015139857
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a machining device and a machining method capable of accurately detecting retention abnormality of a workpiece before machining the workpiece in a short time and capable of preventing breakage of the workpiece or the machining device.SOLUTION: A machining device of a workpiece W which is a both surface polishing device 1 or a both surface lapping device inserts the workpiece W into a retention hole of a carrier 5 and retains the workpiece W, lowers an upper surface plate 2 to a fastening position and holds the carrier 5 which retains the workpiece W with the upper surface plate 2 and a lower surface plate 3 and machines both surfaces of the workpiece W at the same time. The machining device has a memory medium 13 for recording a polishing load when lowering the upper surface plate 2 to the fastening position beforehand in such a state that the workpiece W is normally retained in the retention hole of the carrier 5 and has a control device 12 which calculates a difference between the polishing load when lowering the upper surface plate 2 to the fastening position in such a state that the workpiece W is retained in the retention hole of the carrier 5 and a polishing load recorded on the memory medium 13 and, when the calculated difference exceeds a threshold, judges retention abnormality of the workpiece W.
Inventors:
YASUDA TAICHI
ENOMOTO TATSUO
ENOMOTO TATSUO
Application Number:
JP2014014920A
Publication Date:
August 03, 2015
Filing Date:
January 29, 2014
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
International Classes:
B24B37/34; B24B7/17; B24B37/08; H01L21/304
Domestic Patent References:
| JPH02106269A | 1990-04-18 | |||
| JPH0425371A | 1992-01-29 | |||
| JP2013078826A | 2013-05-02 |
Attorney, Agent or Firm:
Mikio Yoshimiya