Title:
MACHINING DEVICE
Document Type and Number:
Japanese Patent JP2022127872
Kind Code:
A
Abstract:
To provide a machining device that facilitates work of pasting a dicing tape on a back surface of a wafer formed with a ring-shaped reinforcing portion in a projection shape to be integrated with a frame, and cutting the reinforcing portion to be removed from the wafer.SOLUTION: A machining device 2 includes: wafer carrying means 10; a wafer table 12 that supports a carried wafer; frame carrying means 68; a frame table 70 that supports a carried frame 64; tape pasting means 98 that pastes a tape 96 to the frame; frame carrying means 100 with a tape; tape pressure-adhering means 102 pressure-adhering the tape of the frame with the tape, onto a back surface of the wafer; frame unit carrying means 192; reinforcing portion removal means 194 that has removal detection means detecting removal of a ring-shaped reinforcing portion and cutting and removing the reinforcing portion; unit carrying means 196 with no ring; and a frame cassette table 200 on which a frame cassette 198 storing the unit with no ring is placed.SELECTED DRAWING: Figure 1
Inventors:
KAKINUMA YOSHINORI
SAITO YOSHINOBU
MASUDA YUKIYASU
YOSHIKAWA TOSHIYUKI
TSUCHIYA TOSHIO
TAKENAKA MASANOBU
HONGO TOMOYUKI
SAITO YOSHINOBU
MASUDA YUKIYASU
YOSHIKAWA TOSHIYUKI
TSUCHIYA TOSHIO
TAKENAKA MASANOBU
HONGO TOMOYUKI
Application Number:
JP2021026093A
Publication Date:
September 01, 2022
Filing Date:
February 22, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; H01L21/683
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko