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Patent Searching and Data


Title:
MACHINING OBSERVATION DEVICE
Document Type and Number:
Japanese Patent JPH10223574
Kind Code:
A
Abstract:

To obtain a scanning-type ion microscopic image of a machining section without changing the angle of a sample by providing a sample-supporting part for supporting a sample surface at the cross point between an ion beam irradiation axis for machining and an ion beam irradiation axis for observation.

A sample-retaining part has a sample stage 6 for supporting a sample 7 and moving it in horizontal direction, a mirror 19, and a laser position measuring device 20, and the sample 7 is placed on the stage 6. A beam irradiation axis 102 of an ion beam irradiation system 2 for observation is tilted by 60° from a beam irradiation axis 101 of an ion beam irradiation system 1 for machining and the surface of the sample 7 placed on the sample stage 6 is arranged at the cross point between the axes 101 and 102. The angle between the sample surface to be machined and the irradiation axis 101 of the irradiation system 1 for machining is 90°, while the angle between the sample surface to be machined and the irradiation axis 102 of the irradiation system 2 for observation is approximately 30°.


Inventors:
HIROSE HIROSHI
ONISHI TAKESHI
ARIMA YOSHIO
IWAMOTO HIROSHI
Application Number:
JP2780397A
Publication Date:
August 21, 1998
Filing Date:
February 12, 1997
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
G01B17/00; G01B21/30; G01R31/302; G21K7/00; H01J37/30; H01J37/305; H01J37/317; H01L21/302; H01L21/66; G01B9/04; (IPC1-7): H01L21/302; G01B9/04; G01B17/00; G01B21/30; G01R31/302; H01J37/305; H01J37/317; H01L21/66
Attorney, Agent or Firm:
Kazuko Tomita