Title:
加工システム及び方法
Document Type and Number:
Japanese Patent JP7203542
Kind Code:
B2
Abstract:
To provide a processing system and method of processing a workpiece surface of a workpiece with high accuracy and flatness.SOLUTION: A processing system 1 includes: a CMP apparatus 20 for pressing a wafer W against a polishing pad 22 to polish the entire surface of the wafer W; and a trimming device 30 for locally trimming the surface of the wafer W by irradiating a trimming target area having a height equal to or higher than a predetermined threshold on the polished wafer W surface with a gas cluster ion beam (GCIB).SELECTED DRAWING: Figure 5
Inventors:
Hiroyuki Sakai
Application Number:
JP2018169236A
Publication Date:
January 13, 2023
Filing Date:
September 10, 2018
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/304; B23K15/00; B24B7/04; B24B37/10
Domestic Patent References:
| JP2017181731A | ||||
| JP2004310067A | ||||
| JP11269669A |
Foreign References:
| WO2017138355A1 |
Attorney, Agent or Firm:
Takamitsu Shimizu