Title:
MACHINING TOOL WITH ABRASIVE GRAIN BONDED BY USE OF NOVEL METAL BOND, AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3210548
Kind Code:
B2
Abstract:
PURPOSE: To provide an abrasive grain machining tool containing abrasive grains and hard phase particles capable of reducing infiltration treatment temperature by bonding abrasive grains and hard phase particles by a metal bond of Cu-P alloy having a near-eutectic point composition.
CONSTITUTION: A grindstone 10 consists of a metallic core 20 having a bore 30 at the center thereof and an abrasive grain composition 40 bonded to the metallic core 20. In a manufacturing method of an abrasive grain machining tool, a molded body of diamond abrasive grains 41 is formed using adhesive on an inner face of a die having a final shape of the tool. Next, a mixture of hard phase particles such as W, second abrasive grains, and wax for lubrication is pressed around the diamond abrasive grain molded body for molding. Then, the metallic core 20 is arranged at the center of a cavity of a tool molding die, W powders are filled into an annular space between the metallic core 20 and the diamond abrasive grain molded body, and then a metal bond of Cu-P alloy having a near-eutectic point composition is infiltrated under reduction condition to bond diamond, W particles, second abrasive grain mixture, and W powders.
Inventors:
Richard M. Andrews
Application Number:
JP14187495A
Publication Date:
September 17, 2001
Filing Date:
June 08, 1995
Export Citation:
Assignee:
Norton Company
International Classes:
B24D3/00; B24D3/02; B24D3/06; B24D3/08; C22C26/00; (IPC1-7): B24D3/08; B24D3/00; B24D3/02
Domestic Patent References:
| JP5325985A | ||||
| JP224061A |
Attorney, Agent or Firm:
Takashi Ishida (3 others)