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Patent Searching and Data


Title:
MACROMOLECULAR COMPOUND, RESIN COMPOSITION FOR PHOTORESIST AND METHOD FOR PRODUCING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JP2006063239
Kind Code:
A
Abstract:

To provide a macromolecular compound for photoresists capable of forming highly water-resistant resist film.

The macromolecular compound is composed of monomer units each represented by formula (I) (wherein, Ra is H, a halogen atom, 1-6C alkyl or 1-6C haloalkyl; A is a 1-20C straight-chain or branched-chain alkylene group; the carboxy group in the formula may be in a salt form) and monomer units each having such a group as to be alkaline soluble by eliminating part thereof by the action of an acid.


Inventors:
Koyama, Yutaka
Application Number:
JP2004000249492
Publication Date:
March 09, 2006
Filing Date:
August 30, 2004
Export Citation:
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Assignee:
DAICEL CHEM IND LTD
International Classes:
C08F220/28; C07C69/54; C08F220/16; C08F232/08; G03F7/039; H01L21/027
Attorney, Agent or Firm:
後藤 幸久