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Title:
MAGNETIC SENSOR AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008267863
Kind Code:
A
Abstract:

To provide a magnetic sensor capable of avoiding property degradation and easily realizing miniaturization.

A magnetic sensor 10 includes a multi-layered wire board laminated with a plurality of wiring boards 20, 50, 60 which has a conductive layer 22, 52, 62 on one side of insulating member 21, 51, 61 and an adhesive layer 23, 53, 63 on the opposite side, having conductive through holes 24, 54, 63 which penetrate the insulating member. In the adhesive layer 23 of the wiring board 20, one of a plurality of wiring boards constituting the multi-layered wire board, a magnetic material element chip 30 being performed an annealing processing is included, and in the adhesive layer of another wiring board, a thin film magnet chip 40 is included. Electrodes 33, arranged at both end parts of a magnetic material element 32 of the magnetic material element chip 30, are conducted to the conductive layer 22 of one wiring board 20 through the conductive through holes 24 arranged in one wiring board 20.


Inventors:
NAGASU KATSUFUMI
AIZAWA TAKUYA
NAKAO SATORU
Application Number:
JP2007108199A
Publication Date:
November 06, 2008
Filing Date:
April 17, 2007
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
G01R33/06; H01L43/00; H01L43/02; H01L43/08
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama