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Title:
磁気センサモジュール
Document Type and Number:
Japanese Patent JP4754985
Kind Code:
B2
Abstract:

To reduce the phase lag of output amplitude of a semiconductor magnetoresistive element used in detecting a rotating angle of a gear or the like, and to simplify a magnetic sensor module assembly by a significant amount.

An azimuth-aligning groove 27 is formed along the outer periphery of the semiconductor magnetoresistive element, having two or more MR-sensor chips mounted, thereby improving the assembling accuracy for the outer case. Furthermore, a magnet insertion hole for inserting a magnet to be mounted on a rear surface is integrally formed, when sealing resin 25 is resin-formed. Furthermore, bending a leg 23 of an elongated lead frame eliminates a complex process of connecting a terminal of the semiconductor magnetoresistive element with a terminal pin, after it has been mounted once on a printed board.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Hiroto Goto
Ichiro Shibasaki
Application Number:
JP2006041340A
Publication Date:
August 24, 2011
Filing Date:
February 17, 2006
Export Citation:
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Assignee:
Asahi Kasei Electronics Co., Ltd.
International Classes:
G01R33/09; G01D5/16; G01D5/245; H01L23/28; H01L43/02; H01L43/08
Domestic Patent References:
JP2005337866A
JP10144824A
JP2002365352A
Attorney, Agent or Firm:
Yoshikazu Tani