Title:
高温熱処理に適した磁気トンネル接合
Document Type and Number:
Japanese Patent JP7133613
Kind Code:
B2
Abstract:
Embodiments herein provide film stacks that include a buffer layer; a synthetic ferrimagnet (SyF) coupling layer; and a capping layer, wherein the capping layer comprises one or more layers, and wherein the capping layer, the buffer layer, the SyF coupling layer, or a combination thereof, is not fabricated from Ru.
Inventors:
Shue, Lin
Chin, Chi Hong
Ann, Jess
Pakara, Mahendra
Wan, Ronjun
Chin, Chi Hong
Ann, Jess
Pakara, Mahendra
Wan, Ronjun
Application Number:
JP2020502375A
Publication Date:
September 08, 2022
Filing Date:
May 17, 2018
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L43/08; H01L21/8239; H01L27/105; H01L29/82; H01L43/10
Domestic Patent References:
| JP2013115412A | ||||
| JP2014022730A | ||||
| JP2012195373A | ||||
| JP2014030030A |
Foreign References:
| WO2017086481A1 | ||||
| WO2016189772A1 | ||||
| US20140145792 |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation