Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MAGNETIZATION DEVICE FOR MAGNETIC LINEAR ENCODER AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2017143206
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a magnetization device for a magnetic linear encoder capable of continuously magnetizing a non-magnetized magnetic track of a magnetic material for an encoder, and being manufactured by slightly modifying a magnetization device used for a circular magnetic encoder.SOLUTION: A magnetization device 1A includes a fixing member 2, a chuck 3, a magnetizing yoke 5, an exciting coil 7, and a magnetizing power source 8. The fixing member 2 fixes a magnetic material 10A for an encoder while a magnetic track 11 is held in a cylindrical shape. The chuck 3 rotates around a rotation axis O while holding the fixing member 2. The magnetizing yoke 5 includes a pair of magnetizing heads 5a and 5b, and magnetizes a non-magnetized magnetic track 11 of a magnetic material 10A for an encoder. The magnetizing power source 8 supplies a magnetizing current in which the current direction alternately switches to the exciting coil 7 wound around the magnetizing yoke 5.SELECTED DRAWING: Figure 1

Inventors:
KOIKE TAKASHI
FUKUSHIMA YASUYUKI
NAKAMURA MUNEOKI
Application Number:
JP2016024648A
Publication Date:
August 17, 2017
Filing Date:
February 12, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NTN TOYO BEARING CO LTD
International Classes:
H01F13/00; G01D5/245
Domestic Patent References:
JP2014038939A2014-02-27
JP2009528530A2009-08-06
JP2003257738A2003-09-12
JP2012093193A2012-05-17
JP2007043900A2007-02-15
JPS5696305U1981-07-30
JP2000306736A2000-11-02
JP2003075194A2003-03-12
Foreign References:
US20150243427A12015-08-27
Attorney, Agent or Firm:
Masashi Noda
Shuji Sugimoto



 
Previous Patent: A substrate maintenance module, a substrate processing device, and a substrate treating method

Next Patent: Semiconductor module