Title:
電気流体標準モジュールおよびカスタム回路板アセンブリ
Document Type and Number:
Japanese Patent JP4340926
Kind Code:
B2
Abstract:
A miniature electrofluidic module is disclosed, for receiving one or more fluids and for receiving an electrical connection. In accordance with one aspect of the invention, the module includes a substantially flat fluidic manifold layer for fluid distribution, a substantially flat electrical layer including an electrical circuit, and a substantially flat device layer including micromachined devices. The devices may include electrically actuated valves for modulating the flow of fluids. In another aspect of the invention, an electrofluidic module is combined with an electrofluidic circuit board. In a further aspect, an electrofluidic system such as a dialysate handling system is disclosed, including a fluidic fixture and an electrofluidic assembly incorporating electrofluidic devices. In a still further aspect of the invention, a method is disclosed for interfacing micromachined devices to electrical and fluidic interfaces on a fixture, including packaging the devices into a module and providing electrical and fluidic interfaces between the module and the fixture.
Inventors:
Packard, Warren Jay
German, John H
German, John H
Application Number:
JP52757596A
Publication Date:
October 07, 2009
Filing Date:
January 26, 1996
Export Citation:
Assignee:
Baxter, International, Inc.
International Classes:
A61M1/28; F15B21/06; F15C5/00; F16K99/00
Domestic Patent References:
| JP464701A | ||||
| JP54148980A |
Attorney, Agent or Firm:
Akaoka Michio