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Title:
MAIN SPINDLE DEVICE
Document Type and Number:
Japanese Patent JP2014000637
Kind Code:
A
Abstract:

To provide a main spindle device capable of further ensuring chatter vibration suppression.

A main spindle device includes: a main spindle 20 holding a rotating tool 21, and driven to rotate; ball bearings 41 to 44 rotatably supporting the main spindle 20; and a damping-added bearing 50 rotatably supporting the main spindle 20, and having a higher damping coefficient C1 than damping coefficients C2 to C5 of the respective ball bearings 41 to 44. The damping coefficient C1 of the damping-added bearing 50 is in a range from 10,000 N m/s to 1,000,000 N m/s.


Inventors:
MATSUNAGA SHIGERU
OKITA TOSHIYUKI
TANASE RYOTA
Application Number:
JP2012137526A
Publication Date:
January 09, 2014
Filing Date:
June 19, 2012
Export Citation:
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Assignee:
JTEKT CORP
International Classes:
B23Q11/00; B23B19/02
Domestic Patent References:
JPH068005A1994-01-18
JPS5260492A1977-05-18
JPS61252044A1986-11-10
JP2011079078A2011-04-21
JP2011235363A2011-11-24
JPS5260492A1977-05-18
JPS61252044A1986-11-10
JPH068005A1994-01-18
Attorney, Agent or Firm:
Kobayashi Osamu
Kiichi Yamamoto