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Title:
MAINTENANCE METHOD OF FLUID EJECTION DEVICE AND FLUID EJECTION DEVICE
Document Type and Number:
Japanese Patent JP2010023453
Kind Code:
A
Abstract:

To provide the maintenance method of a fluid ejection device which reduces occurrence of problems due to a fluid, by removing the fluid adhering to a seal surface, and also to provide the fluid ejection device.

The fluid ejection device includes: an ejection head having an ejection surface in which an ejection port for ejecting the fluid is formed; and a maintenance part having a cap member coming into contact with the ejection surface and a wiping member wiping the ejection surface. The device adopts a method including: a first process for sequentially performing a suction operation S45 for bringing the cap member into contact with the ejection surface, to suck the fluid in space formed by the ejection surface and the cap member, a separation operation S46 for separating the cap member from the ejection surface, and a wiping operation S47 for wiping the ejection surface by the wiping member; and a second process for sequentially performing a transfer operation S50 for bringing the cap member into contact with the ejection surface, to transfer the fluid adhering to the cap member to the ejection surface, a separation operation S51, and a wiping operation S52.


Inventors:
NAKAJIMA HIROMICHI
Application Number:
JP2008190949A
Publication Date:
February 04, 2010
Filing Date:
July 24, 2008
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/165; B41J2/18; B41J2/185
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Kazunori Onami