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Title:
MALEIC ACID RESIN COMPOSITION AND ITS USE IN PRODUCING COMPOSITE MATERIAL WITH FIBROUS REINFORCEMENT
Document Type and Number:
Japanese Patent JPH101506
Kind Code:
A
Abstract:

To obtain a maleic acid resin compsn. which can be cured by ionization without requiring an additional thermal posttreatment by compounding a maleic acid resin with a specified amt. of a specific reactive diluent.

This compsn., curable by ionization, is prepd. by compounding 100 pts.wt. maleic acid resin with 10-70 pts.wt. reactive diluent comprising dipentaerythritol pentaacrylate and/or hydroxyethyl methacrylate. The resin is produced by reacting an N, N-bismaleimide represented by formula I [wherein Z is CH3 or Cl; and A is a divalent group such as a single bond, CH2C(CH3)2, O, S, or SO2], a maleimide represented by formula II, III, etc., an acrylate reagent represented by formula IV (wherein R1 is H or CH3; and n is an org. group comprising a 1-30C linear or branched satd. aliph. hydrocarbon group optionally having an 0 or 011 group), and a reagent having a vinyl bond (e.g. vinylpyridine or N-vinylpyrrolidone).


Inventors:
FREDERIC ALEXANDRE BOURSEREAU
DOURTHE PATRICE
Application Number:
JP5962097A
Publication Date:
January 06, 1998
Filing Date:
March 13, 1997
Export Citation:
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Assignee:
AEROSPATIALE
International Classes:
C08J5/04; C08F2/46; C08F2/54; C08F267/10; C08F290/00; C08L35/00; (IPC1-7): C08F2/54; C08J5/04; C08L35/00
Attorney, Agent or Firm:
Yoshio Kawaguchi (3 outside)