Title:
マレイミド樹脂組成物、プリプレグ及びその硬化物
Document Type and Number:
Japanese Patent JP6744234
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: a maleimide resin composition that can be cured even in a process in which epoxy resin can be cured, has excellent heat resistance and dielectric properties (relative dielectric constant and dielectric loss tangent), and is useful for a printed wiring board for electronic apparatus and the like; a prepreg; and a cured product.SOLUTION: A maleimide resin composition comprises an unsaturated double bond group-containing compound (B) in polymaleimide resin (A) represented by the following formula (Rs independently represent H, a C1-10 alkyl group or aromatic group; n is an integer with its average value of 1
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Inventors:
Kazuki Matsuura
Seiji Ehara
Seiji Ehara
Application Number:
JP2017018589A
Publication Date:
August 19, 2020
Filing Date:
February 03, 2017
Export Citation:
Assignee:
NIPPON KAYAKU KABUSHIKI KAISHA
International Classes:
C08F222/40; C08J5/24; C08L35/00
Domestic Patent References:
| JP63152645A | ||||
| JP2009191218A | ||||
| JP2011102345A |
Foreign References:
| WO2015152007A1 |