MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE OF RESIN-SEALING TYPE

Title:

MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE OF RESIN-SEALING TYPE

Document Type and Number:

Japanese Patent JPH03281507

Kind Code:

A

Abstract:

PURPOSE:To obtain the subject composition having excellent adhesion of cured material cured therefrom to a semiconductor element or a lead frame, with excellent releasability of the cured material by containing a maleimide resin being blended with a mixture of a releasing agent and liquid organosiloxane. CONSTITUTION:A releasing agent (e.g. PE wax having 500-4000 molecular weight) is mixed with liquid organosiloxane (e.g. dimethyl-based silicon oil, preferably having Si-H bonding, vinyl group or epoxy group in a molecule) and a resultant mixture is incorporated into a maleimide resin [e.g. N,N'- substituted bismaleimide compound expressed by formula I or poly(phenylmethylene) polymaleimide expressed by formula II ((n) is 1-5)], then the resultant system is contained in the objective composition useful for sealing of a semiconductor element.

Inventors:

FUJIEDA SHINZEI
AZUMA MICHIYA
SHIMOZAWA HIROSHI

Application Number:

JP8186790A

Publication Date:

December 12, 1991

Filing Date:

March 29, 1990

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

C08L35/00; C08F2/44; C08F20/52; C08F22/40; C08F290/00; C08F299/00; C08G59/00; C08G59/40; C08G73/12; C08L33/24; C08L53/00; C08L61/14; C08L63/00; C08L79/08; C08L83/04; H01L23/29; H01L23/31; (IPC1-7): C08F2/44; C08F22/40; C08F299/00; C08G59/40; C08G73/12; C08L35/00; C08L61/14; C08L79/08; C08L83/04; H01L23/29; H01L23/31

Attorney, Agent or Firm:

Takehiko Suzue (3 outside)

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